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PlasmaEtch Process - 美國**9，548，227 B2 - 使用等離子體放電管的微波誘導等離子體。

微波誘導式等離子芯片開封系統 ---- PlasmaEtch

無論是傳統的金線樣品，還是樣品都采用銅線或銀線，PlasmaEtch都能提供安全可靠的蝕刻。

As the world moves toward more eco-friendly processes and the semiconductor manufacturing industry continues to make smaller parts with sensitive internal components， failure analysts are presented with a unique challenge: how do you etch these samples? Nisene Technology Group has bridged the gap between semiconductor manufacturing technology and failure analysis with its latest decapsulation system: the PlasmaEtch.

工作原理：

The PlasmaEtch decapsulation system is a revolutionary patent-pending gas-based semiconductor etching system. Employing a never-before-seen application of microwaved gases inciting chemical radicals for isotropic etching， the PlasmaEtch is the greenest and most cost-effective etching solution available. The PlasmaEtch can etch most sample sizes， encapsulant types， and wire bond types. Whether it’s a more traditional gold wire sample， or if the sample features copper or silver wires， the PlasmaEtch delivers a safe and reliable etch.

PlasmaEtch創新點：

Afterburner Downstream Focused Plasma Etching（延時激發下行聚焦離子蝕刻）

Mass Flow Controlling for All Gases（所有氣體流量可控）

No Microwave Radiation Exposure to Samples During Etch Process（無微波輻射）

Low Temperature Etching（低溫蝕刻）

Isotropic Etching（等向性蝕刻）

Unlike typical and less sophisticated plasma decap systems that take many hours or even days to get to the surface of the die， the PlasmaEtch can clear the encapsulant of most package types and reveal the complete die surface and wire sweep in a matter of a couple hours. Chemical-free decapsulation has never been so effective.

主要特色（Highlights）：

Highly Customizable Etch Recipes（高度可定制的蝕刻配方）Etches a Wide Variety of Package Types（可蝕刻各種各樣的封裝類型）Completely Chemical-free Decap（完全非化學方式蝕刻）Eco-friendly（生態友好環保）Touchscreen Interface（觸控屏）PC/Windows-based GUI（基于PC / Windows的GUI）The Only Solution for Silver Wires（銀線的**解決方案）