粉體行業(yè)在線展覽
面議
1000
漆膜附著力測(cè)試
Film adhesion testing of thin films and stacks on substrates for material evaluation
3DIC TSV and BWS TTV硅片表面形貌測(cè)量
Film Stress薄膜應(yīng)力量測(cè)儀
FEOL Electrical Characterization 電學(xué)特性
Thin wafer metrology 晶圓測(cè)量學(xué)
Film Adhesion漆膜附著力測(cè)試
Film adhesion testing
of thin films and stacks on substrates
for material evaluation.
FSM offers two techniques suitable for low and medium adhesion strength tests.
BSD-660
JB-5
JW-DX
miniX
F-Sorb 2400
ASAP 2420系列
Acorn
FT-301系列
GCTKP-700
JT-2000P3
Autosorb-iQ
BELSORP MINI X