粉體行業在線展覽
面議
987
儀器簡介:
Recently Refurbished
New Software, Control Hardware,
Dry Process Pump, Dry Loadlock
Pump and Heater Assembly.
技術參數:
Wafer capacity: Three two inch wafers.
Load lock: Loadlock chamber with hepa filter loading area.
Heater: Single zone graphite heater
Temperature control: Temperature monitor single point T/C, Eurotherm controller, single point
Sekidenko Pyrometer.
Group III MO sources: TMGa - 2 units; TMIn - 2 units; TMAl -2 units
Group V hydride sources: AsH3 -2 lines; PH3 -2 line.
Dopants MO: CP2Mg -1 unit, DeZn - 1 unit
Dopants Hydride: H2/SiH4 - 2 lines
Neslab bath: 6 units.
Piezocon: Single channel concentration monitor for TMIn expandable to Four channels (option).
Pump: EBARA A30;
Exhaust system: particle filter/ housing; Phosphorus trap; P-trap automatic regeneration system
(option).
Gas Monitoring: CM4 4 point toxic gasmonitor.(integration option)
Software: Windows based control software.
XRD-晶向定位
CVD 真空化學氣相沉積設備
等離子體增強化學氣相沉積系統CVD
自動劃片機
BTF-1200C-RTP-CVD
Gasboard-2060
Pentagon Qlll
等離子化學氣相沉積系統-PECVD
定制-電漿輔助化學氣相沉積系統-詳情15345079037
HSE系列等離子刻蝕機